Hi3519AV100
Hi3519A V100 4K Smart IP Camera SoC
Hi3519AV100.PDF 商品信息
Hi3519A V100 is a high-performance and low-power 4K Smart IP Camera SoC designed for IP cameras, action cameras, panoramic cameras, rear view mirrors, and UAVs. Hi3519A V100 also supports 4K raw data output, facilitating post editing. With the advanced low-power process and architecture design, Hi3519A V100 provides users with long-lasting battery life. （点击即可咨询芯片详细信息）
Hi3519AV100’s Features
1. Low Power
- 1.9 W power consumption in a typical scenario for 4K x 2K (3840 x 2160)@30 fps H.265 encoding+neural network algorithm
2. SVP
- A neural network inference engine (NNIE), a highperformance DSP, and multiple CV acceleration engines that facilitate customers' algorithm development for achieving product differentiation
- Multiple neural network options
- 2.0 TOPS computing performance
- Complete APIs and toolchains
- Multiple applications such as face detection/recognition and target detection/tracking
3. 4K@60 fps Encoding
- 4K x 2K (3840 x 2160)@60 fps or 1080p@240 fps H.265/H.264 encoding
4. Multi-Sensor Inputs
- Up to 5-channel sensor inputs, supporting applications such as panoramic camera and UAVs
5. Hardware-based Multi-Channel Video Stitching
- 2-channel 3K x 3K (3000 x 3000)@30 fps or 4-channel 1080p@30 fps stitching and recording
6. High-Speed Interface
- PCIe, USB 3.0, and SDIO 3.0 interfaces that facilitate customers' extension of external
functional modules
Hi3519AV100’sKey Specifications
1. Processor Core
- Dual-core ARM Cortex-A53@1.4 GHz, 32 KB I-cache, 32 KB D-cache or 256 KB L2-cache
- Neon acceleration and integrated FPU
2. DSP
- Integrated Tensilica Vision P6 DSP@630 MHz
- 32 KB I-cache, 32 KB I-RAM, and 512 KB D-RAM
- 0.3 TOPS neural network computing performance
- Huawei LiteOS
3. NNIE
- Multiple neural network options, such as AlexNet, VGG, ResNet, and GoogLeNet
- Multiple neural network options for target detection, suchas the Faster R-CNN, SSD, and
YOLOv2
- 2.0 TOPS neural network computing performance
- Complete APIs and tool chains (compilers and simulators) to adapt to customized networks
4. Video Encoding and Decoding
- H.265 main profile, level 5.1
- H.264 baseline/main/high profile, level 5.1
- I-/P-/B-slice supported for H.264/H.265 encoding and decoding
- Baseline JPEG
- Maximum resolution for H.264/H.265 encoding and decoding: 8192 x 8192
- H.265/H.264 encoding and decoding performance:
− 3840 x 2160@60 fps+720p@30 fps encoding
− 3840 x 2160@60 fps decoding
− 3840 x 2160@30 fps encoding+3840 x 2160@30 fps decoding
- Maximum resolution for JPEG encoding and decoding:8192 x 8192
- Maximum JPEG encoding and decoding performance: 16 MP (4608 x 3456)@30 fps
- Multiple bit rate control modes, such as CBR, VBR,AVBR, FixQp, and QpMap
- Up to a bit rate of 120 Mbit/s for H.265 encoding outputs and 200 Mbit/s for H.264 encoding outputs
- Encoding of up to eight ROIs
5. VI Interface
- 12-lane image sensor serial inputs, as well as MIPI, sub-LVDS, HiSPi, and SLVS-EC interfaces
- Up to 5-channel sensor serial inputs and multiplecombination modes: 12-lane,8-lane+4-lane, or 4-lane+4 x 2-lane
- Maximum input resolution: 7680 x 4320
- 10-/12-/14-bit Bayer RGB DC timing VI
- BT.656 and BT.1120 VI 1–channel to 4-channel YUV inputs through the MIPI virtual channels
6. ISP and Image Processing
- Multi-channel TDM to process multi-sensor video inputs
- Adjustable 3A functions (AE, AWB, and AF)
- FPN removal
- 2-frame WDR exposure, local tone mapping, strong light suppression, and backlight compensation
- Defect pixel correction and lens shading correction
- Multi-level 3DNR, which removes motion smearing and chroma noise and provides excellent image effects in low illumination
- 3D-LUT color adjustment
- Image dynamic contrast enhancement and edge enhancement
- CAC and purple fringe removal
- Dehaze
- 6DoF DIS and rolling shutter correction
- LGDC and fisheye correction
- Image rotation by 90° or 270°
- Image mirroring and flipping
- Multi-channel 1/15.5x–16x scaling outputs
- OSD overlaying of up to eight regions before encoding
- ISP adjustment tool on the PC
7. 2D Graphics Processing
- BitBlt operation
- Line drawing
- Alpha blending
- Color key
- CSC
8. Hardware Accelerated Engine for Video Stitching
- 2-channel and 4-channel AVS
- Stitching performance:
− 2-channel 3000 x 3000@30 fps VI and 3840 x2160@30 fps VO
− 4-channel 1080 x 1920@30 fps VI and 3840 x 2160@30 fps VO
9. VO Interface
- HDMI 2.0, supporting up to 4K x 2K (4096 x 2160)@60 fps outputs
- 4-lane MIPI DSI, supporting up to 1080p@60 fps outputs
- 6-/8-/16-/24-bit digital LCD/BT.656/BT.1120 interface, supporting up to 1080p@60 fps RGB/YUV outputs
- Two independent HD VO channels (DHD 0 and DHD 1):
− Any two interfaces can be used for the display of different sources.
− DHD 0 supports 36-picture split display.
− DHD 1 supports 16-picture split display.
- One PIP layer, which can be overlaid with DHD 0 or DHD 1
- Two full-screen GUI graphics layers in ARGB1555 or ARGB8888 format for DHD 0 and DHD 1
- One hardware cursor layer in ARGB1555 or ARGB8888 format (configurable), supporting a maximum resolution of 256 x 256
- One scaling WBC channel
10. CV Hardware Accelerated Engine
- Hardware acceleration for binocular depth map computing, supporting the processing performance up to 720p@30 fps
- Hardware acceleration for IVE 2.1 intelligent operators for feature point detection, optical flow, and computer morphology processing, and so on
11. Audio Interface
- Integrated audio codec, supporting 16-bit audio inputs and outputs
- Dual-channel differential MIC inputs for reducing the background noise
- I2S interface for 8-channel audio TDM inputs and dual-channel audio outputs (mutually exclusive with the built-in audio codec)
- HDMI audio output
12. Audio Encoding and Decoding
- Voice encoding and decoding complying with multiple protocols by software
- Audio encoding in formats such as G.711, G.726, and AAC
- VQE
13. Network Interface
- One GE interface:
− RGMII and RMII modes
− 10/100 Mbit/s half-duplex or full-duplex
− 1000 Mbit/s full-duplex
− TSO for reducing the CPU usage
14. Security Engine
- AES, DES, and 3DES algorithms implemented by using hardware
- RSA1024/2048/3072/4096 signature verification algorithm implemented by using hardware
- HASH-SHA1/224/256/384/512 and HMAC_SHA1/224/256/384/512 tamper proofing algorithms implemented by using hardware
- Integrated 32-kbit OTP storage space and hardware random number generator
- Secure boot
- Memory and I/O security isolation
15. Peripheral Interface
- Two SDIO 3.0 interfaces:
− SDIO 0 supports the SDXC card
− SDIO 1 supports the Wi-Fi module.
- One USB 3.0/PCIe 2.0 multiplexing port
− USB 3.0 only or PCIe 2.0 X1+USB 2.0.
− RC and endpoint supported as the PCIe 2.0 interface
− Configurable USB host/device mode as the USB 3.0 interface
- One USB 2.0 port, supporting configurable host/device mode
- Internal POR signal output and external reset input
- Independent battery for the built-in RTC
- Integrated 4-channel LSADC
- Nine UART interfaces (Some pins are multiplexed with other pins.)
- Multiple I2C, SPI, and GPIO interfaces
- One IR interface
- Eight PWM interfaces (Some pins are multiplexed with other pins.)
16. External Memory Interface
- 32-bit DDR4/LPDDR4 SDRAM interface
− Maximum frequency of 1333 MHz for the DDR4/LPDDR4 SDRAM
− Maximum DDR address space of 3.5 GB
- SPI NOR flash interface
− 1-/2-/4-line mode
− 3-/4-byte address mode
− Maximum capacity of 256 MB
- SPI NAND flash interface
− SLC flash
− 2 KB/4 KB page size
− 8-/24-bit ECC (unit: KB)
− Maximum capacity of 1 GB
- NAND flash interface
− 8-bit data width
− SLC flash
− 2 KB/4 KB page size
− 8-/16-/24-bit ECC (unit: KB)
− Maximum capacity of 1 GB
- eMMC 5.1 interface
− HS400
− Maximum capacity of 2 TB
17. Configurable Boot Modes
- Booting from the BOOTROM
- Booting from the SPI NOR flash
- Booting from the SPI NAND flash
- Booting from the NAND flash
- Booting from an eMMC
18. Multiple Image Burning Modes
- Image burning through UART 0
- Image burning through an SD card
- Image burning through a USB device
19. SDK
- Linux SMP
- Linux+Huawei LiteOS dual-system solution
- High-performance H.265 iOS/Android decoding library
20. Physical Specifications
- Power consumption
− 1.9 W power consumption in a typical scenario for 4K x 2K (3840 x 2160)@30 fps encoding+neural network algorithm
− Multi-level power saving mode
- Operating voltages
− 0.8 V core voltage
− 1.8 V or 3.3 V I/O voltage
− 1.2 V DDR4 SDRAM interface voltage
− 1.1 V LPDDR4 SDRAM interface voltage
- Package
− RoHS-compliant FCCSP
− Body size: 15 mm x 15 mm (0.59 in. x 0.59 in.)
− Lead pitch: 0.65 mm and 0.4 mm hybrid pitch
− Operating temperature: 0°C–70°C
Hi3519AV100’s Block Diagram
Hi3519AV100’sTypical Application Circuit
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