H27UBG8T2BTR-BC is a single 3.3V 32GbitNAND flash memory. The Device contains 2 planes in a single die. Each plane is made up of the 1,024 blocks. Each block consists of 256 programmable pages. Each page contains 8,832bytes.
Features
1. Multi Level Cell(MLC) Technology
2. NAND Interface
- x8 bus width
- Multiplexed address/ Data
-Pin-out compatibility for all densities
3. Power Supply Voltage
- VCC = 2.7 V ~ 3.6 V
- VCCQ = 2.7 V ~ 3.6 V / 1.7 V ~ 1.95 V
4. Organization
- Page size : (8K+640spare)bytes
- Block size : (2048K+160K)bytes
- Plane size : 1024blocks
- Device size : 2048blocks
5. Page Read/Program Time
- Random Read Time(tR): 90us(MLC), 40us(SLC)
- Sequential Access: 20 ns (min.)
- Page Program Time: 1300us(MLC), 500us(SLC)
- Parallel operations on both planes available,effectively halving program, read and erase time
6. Block Erase
-Block Erase Time: 3.5ms(Typ.)
7. Multi-Plane Architecture
- Two independent planes architecture
- Parallel operations on both planes available, effectively halving program, read and erase time
8. Command Set
- ONFI 2.2 Compliant Command Set
- Interleaved Copyback Program
- Read Unique IDs
9. Package
- Package type : TSOP
- Chip count : SDP(1CE, Single) = 1stack DDP(2CE, Dual) = 2stack
- Pin Count : 48
10. Electronic Signature
- 1st cycle: Manufacturer Code
- 2nd cycle: Device Code
- 3rd cycle: Internal chip number, Cell Type, Number ofSimultaneously Programmed Pages.
- 4th cycle: Page size, Block size, Organization, Spare size
- 5th cycle: Multi-plane information
- 6th cycle: Technology, EDO, Interface
11. Chip Enable Don’t Care
- Simple interface with microcontroller
12. Hardware Data Protection
- Program/Erase locked during Power transitions
13. Reliability
- TBD
Block Diagram
Package
Ordering Information